Silicone Based Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
The TIF®100-85-11US Series is a thermal pad designed specifically for environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with an almost fluid-like extreme softness, ensuring perfect contact interface fillng even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing superior heat dissipation solutions and physical protection for the most delicate electronic components.
Features
> High thermal conductivity
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Notebook
> Power supply
> Heat pipe thermal solutions
| Typical Properties of TIF®100-85-11US Series |
| Property |
Value |
Test method |
| Color |
Dark Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.5 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.012~0.020 |
0.030~0.200 |
ASTM D374 |
| (0.30~0.50) |
(0.75~5.00) |
| Hardness |
35 Shore 00 |
20 Shore 00 |
ASTM 2240 |
| Continuos Use Temp |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥ 5500 |
ASTM D149 |
| Dielectric Constant |
6.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Thermal Conductivity (W/m-K) |
8.5 |
ASTM D5470 |
| 8.5 |
ISO22007 |
| Fire rating |
V-0 |
UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.012" (0.30 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
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4. We will reply you as soon as possible with Email or online.
FAQ:
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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