OEM Customized Size Thermal Conductive Pad Thermal Conductive Silicon Pad
The TIF®100-01E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features
> Good thermal conductive: 1.5W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications
> Cpu heat sinking
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
| Typical Properties of TIF®100-01E Series |
| Property | Value | Test method |
| Color | Black | ****** |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
| Specific Gravity | 2.3 g/cc | ASTM D297 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | > 5500 VAC | ASTM D149 |
| Dielectric Constant | 4.7 MHz | ASTM D150 |
| Volume Resistivity | 1.0 X1012 Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Outgassing(TML) | 0.35% | ASTM E595 |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
