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Brand Name : Ziitek
Model Number : TIE280-25AB
Certification : RoHs
Place of Origin : China
MOQ : 2KG/LOT
Supply Ability : 1000KG
Delivery Time : 2-3 work day
Packaging Details : 1kg/can
Price : 0.1-100USD/KG
Payment Terms : T/T
Prodcuts name : High Thermal Conductive Potting Epoxy Adhesive Thermally Conductive Glue For Electronic Component Encapsulation Protection
Hardness (Shore 00) : 85
Recommended Operating Temperature (℃) : -40℃ to 160℃
Density(g/cm³) : 2.0
Keywords : Thermally Conductive Glue
Thermal Conductivity : 2.5 W/m-K
Application : Electronic Component Encapsulation Protection
Dielectric Constant @1MHz : 4.2
Breakdown Voltage (V/mm) : ≥10000
High Thermal Conductive Potting Epoxy Adhesive Thermally Conductive Glue For Electronic Component Encapsulation Protection
Products description
TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and room temperature curing properties. It can complete the curing process at room temperature and is convenient for on-site operation and construction. And this material has excellent fire and flame retardant properties, which can meet the high safety requirements of electronic devices.It is particularly suitable for the sealing protection of capacitors,small electronic components,and precision circuit modules,and can provide long-term reliable mechanical support and environmental protectionfor sensitive components.
Features
>Good thermal conductivity
>Excellent insulation performance
>Two-part formulation for easy storage
>Excellent low and high temperature mechanical and chemical stability
>Ambient or accelerated cure schedules
Application
>Electronic component encapsulation protection
>Power Supply and Electrical Control
>LED Lighting and Display
>New Energy and Automotive Electronics
>Communication and network equipment
| Typical Properties of TIE®280-25AB Series | ||
| Uncured Material Properties | ||
| Property | Value | Test Method |
| Construction | Epoxy resin | - |
| Color/Part A | Black | Visual |
| Color/Part B | Gray | Visual |
| Part A Viscosity (mPa·S) | 50,000 | ASTM D2196 |
| Part B Viscosity (mPa·S) | 30,000 | ASTM D2196 |
| Mix Ratio | 1:1 | - |
| Shelf life (Month) | 12(Unopened) | - |
| Cure Schedule | ||
| Pot Life @ 25°C | 45 mins | Ziitek Test Method |
| Cure @ 25°℃ | 12 hours | Ziitek Test Method |
| Cure @ 70°C | 30 mins | Ziitek Test Method |
| Cure @ 100℃ | 15 mins | Ziitek Test Method |
| Cure Material Properties | ||
| Color | Gray | Visual |
| Density(g/cm³) | 2.0 | ASTM D792 |
| Hardness (Shore 00) | 85 | ASTM D2240 |
| Breakdown Voltage (V/mm) | ≥10,000 | ASTM D149 |
| Dielectric Constant @1MHz | 4.2 | ASTM D150 |
| Volume Resistivity (Ohm·cm) | >1.0x1012 | ASTM D257 |
| Thermal Conductivity (W/m·K) | 2.5 | ASTM D5470 |
| Recommended Operating Temperature (℃) | -40~160 | - |
| Flame Rating | V-0 | UL 94 |



Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.|
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High Thermal Conductive Potting Epoxy Adhesive Thermally Conductive Glue For Electronic Component Encapsulation Protection Images |